
TentaGel® HL RAM Resin
This highloaded version of TentaGel® combines a significantly higher capacity with the advantages of TentaGel® resins. The spacer is in the range of MW 1500 - 2000 Da.
This resin is functionalized with a modified Rink Amide linker and is ideal for the Fmoc SPPS of peptide amides. Cleavage from this support is achieved with 95% TFA.