TentaGel® HL RAM Resin

This highloaded version of TentaGel® combines a significantly higher capacity with the advantages of TentaGel® resins. The spacer is in the range of MW 1500 - 2000 Da.

This resin is functionalized with a modified Rink Amide linker and is ideal for the Fmoc SPPS of peptide amides. Cleavage from this support is achieved with 95% TFA.

price: 67


TentaGel® HL RAM

particle size: 75 µm
capacity: 0.3 - 0.4 mmol/g

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